A manufacturer of membrane key switches shares with you a method and process for producing such switches.

Release date:

2021-09-24


This utility model relates to a Manufacturer of Thin-Film Push-Button Switches The film-type membrane switch. Today, many electronic products utilize membrane switches as their operation panels, offering not only convenience and elegance in handling but also presenting challenges such as electromagnetic shielding and electrostatic interference. On one hand, the inherent design of membrane switches often includes numerous gaps, making it difficult to achieve effective shielding for electronic devices. On the other hand, the circuitry and components within the switch area are particularly susceptible to RF and electrostatic interference, potentially leading to operational errors. Therefore, addressing the shielding issue becomes especially critical.

Manufacturer of Thin-Film Push-Button Switches The purpose is to provide a thin-film key switch. The technical solution from the thin-film switch manufacturer is as follows: a thin-film key switch consisting of a printed circuit board and a thin-film key panel covering the printed circuit board. The printed circuit board is sequentially equipped, from bottom to top, with a grounding layer, a power layer, and multiple signal layers. Manufacturer of Thin-Film Push-Button Switches There is a connection between the switch grounding layer and the power supply layer. TVS Power Protector; Electrostatic Discharge (ESD) Resistors are connected between the ground layer and multiple signal layers. At least one process via is provided on the antistatic layer, polyester substrate, pattern layer, shielding layer, second protective layer, and conductive adhesive layer to ensure electrical connection among the antistatic layer, shielding layer, and conductive adhesive layer. The manufacturer of the thin-film key switch produces switches with a printed circuit board whose ground layer is electrically connected to both the shielding layer and the antistatic layer of the thin-film key panel. The antistatic layer is made of transparent conductive ink; the first and second protective layers are UV-curable inks; and the shielding layer is composed of silver paste. The conductive adhesive layer in the thin-film key switch has an area larger than that of each upper-layer component. The antistatic layer has a thickness of 4 µm, while the shielding layer measures 6 µm. Process vias are positioned around the perimeter of the thin-film key panel, each with a diameter of 0.12 mm. Additionally, the shielding layer features a rectangular grid pattern characterized by line widths of 1.0 mm and a line-to-air ratio of 1:4.2.

Manufacturer of Thin-Film Push-Button Switches After adopting the aforementioned technical solution, the following beneficial effects are achieved: The implementation involves parallel connection between the power layer and the ground layer. (1) The TVS power protection device reduces transient electromagnetic interference by incorporating an ESD static resistance connected in parallel between the signal line and the ground layer, thereby minimizing electrostatic phenomena caused by touch. This ensures that the back-end circuit components are safeguarded against damage from high-energy transient surges, preventing malfunctions or key-switch failures due to static electricity and protecting the membrane switch itself. (2) Multiple process vias arranged around the key frame connect the antistatic layer, shielding layer, and conductive adhesive layer, which are then linked to the metal housing via the conductive adhesive layer. This creates a tightly sealed shielding cavity integrated with the device’s overall casing, providing comprehensive protection for the internal components. As a result, the components operate stably without suffering from RF or electrostatic interference. (3) A key cushion layer is positioned between the printed circuit board and the membrane keypad panel, effectively isolating the conductive adhesive layer from the copper foil signal layer on the PCB.

 

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